M5 Pro chip could separate CPU and GPU in ‘server grade’ chips
SMRTR summary
Apple's upcoming M5 Pro chip might use TSMC's SoIC-mH packaging to separate CPU and GPU components, potentially improving performance, yields, and thermal management, with mass production slated for late 2025.
SMRTR provides this summary for quick context. The original article belongs to 9to5Mac.
Read the original article