Huawei says it can build 1.4nm chips without ASML's most advanced machines
SMRTR summary
Huawei claims it can match cutting-edge chip performance without ASML's advanced equipment, which US export controls have blocked it from accessing since 2019. Instead of shrinking transistors further, Huawei is stacking circuit layers and redesigning how data flows between them — a method called "LogicFolding" — targeting 1.4nm-level chip density by 2031. The company has already mass-produced 381 chip models using related techniques, though independent performance comparisons remain unavailable.
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