Apple Looking to Fundamentally Change iPhone Memory Design to Enhance AI Performance
SMRTR summary
Apple plans to switch iPhone memory packaging from stacked to discrete by 2026, improving AI performance. This change will allow for more I/O pins, faster data transfer, and better heat dissipation, potentially appearing in the "iPhone 18" if engineering challenges are overcome.
SMRTR provides this summary for quick context. The original article belongs to Mac Rumors.
Read the original article