300-mm wafers enable transparent chips that bend thousands of times without failing
SMRTR summary
MIT researchers have developed flexible, transparent silicon-photonics chips using standard semiconductor manufacturing on 300-millimeter wafers. Unlike conventional rigid chips, these ultra-thin chips can bend thousands of times around small cylinders without losing performance. Potential uses include body-conforming health monitors and curved augmented-reality displays for pilot visors, replacing bulky optical components with something nearly invisible and highly durable.
SMRTR provides this summary for quick context. The original article belongs to Interesting Engineering.
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