Ultraprecise method of aligning 3D semiconductor chips invented
SMRTR summary
A new laser-based alignment method for 3D semiconductor chips has been developed by University of Massachusetts Amherst researchers. The technique uses metalenses to create holograms, achieving unprecedented precision of 0.017 nm in x-y axes and 0.134 nm in z-axis, potentially lowering chip production costs and enabling new sensor applications.
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