Tiny wrinkle in chip can trap heat and reduce conductivity by 5x, MIT study suggests
SMRTR summary
A one-micrometer wrinkle in chip materials can reduce heat conductivity by 4–5x, causing dangerous hotspots. MIT's laser-pulse X-ray technique maps these defects precisely, helping engineers tackle overheating in AI and high-power electronics.
SMRTR provides this summary for quick context. The original article belongs to Interesting Engineering.
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