Stretchable semiconductor skin created for next-gen Neuralink-like brain implant

A new hydrogel semiconductor developed by University of Chicago researchers combines softness, biocompatibility, and semiconducting properties. This material could revolutionize bioelectronics, enabling better brain implants, pacemakers, and prosthetics. The hydrogel is stretchable up to 150%, has tissue-like softness of 81 kPa, and demonstrates electrical conductivity with charge-carrier mobility of 1.4 cm2 V-1 s-1.