New method to bond diamonds to other materials could enable advanced quantum devices

Scientists at the University of Chicago and Argonne National Laboratory have developed a method to directly bond ultra-thin diamond membranes to materials like silicon and sapphire. This technique involves creating "dangling bonds" on treated surfaces and carefully bonding them together. The innovation overcomes previous limitations and could revolutionize quantum computing, sensing, and conventional electronics by enabling advanced devices and improving performance in applications such as biosensors and cell phones.