Huawei’s new chip design tackles overheating with 55% higher transistor density

Huawei has developed a new chip design called LogicFolding that stacks transistors vertically instead of spreading them flat, solving a major overheating problem in smartphone processors. The upcoming Kirin chip packs 55% more transistors per square millimeter than its predecessor while cutting power use by up to 66%. This matters especially because China faces restrictions on advanced chipmaking equipment, making Huawei's homegrown approach a potential workaround.