Huawei announces 1.4 nm chipmaking technology to compete with TSMC
SMRTR summary
Huawei plans to match TSMC's 1.4 nm chip density by 2031 using "logic folding," a technique that stacks two chips on top of each other to pack more transistors without needing advanced EUV equipment that China currently lacks. The upcoming Kirin 2026 will be among the first chips using this technology.
SMRTR provides this summary for quick context. The original article belongs to NotebookCheck.
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