Chinese startup introduces next-gen optical links to connect thousands of high performing chips
SMRTR summary
Chinese startup Biren has developed optical interconnect technology to link up to 1,024 AI chips together, far beyond the current 128-GPU limit of copper-based connections. This near-packaged optics system could reshape large-scale AI computing, though mass deployment isn't expected until around 2028.
SMRTR provides this summary for quick context. The original article belongs to Interesting Engineering.
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