AMD secures new glass substrate patent as race for the chipmaking technology intensifies
SMRTR summary
AMD is developing glass substrates for advanced chip packaging, as revealed in a new patent. The technology offers superior thermal stability, reduced signal loss, and dimensional accuracy for high-frequency applications, with potential use in future multi-chiplet processors and GPUs.
SMRTR provides this summary for quick context. The original article belongs to TechSpot.
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