A new way to build chips: Sequentially stacking silicon to extend Moore's Law

University of Illinois researchers have found a way to stack silicon computer chips vertically, potentially extending Moore's Law beyond its current limits. By transferring ultra-thin silicon layers — just 10 nanometers thick — at temperatures below 200°C, they avoided damaging existing circuits while achieving 98–100% device yields across three stacked layers. This breakthrough, published in Nature, could dramatically increase computing power for AI and data-intensive applications.