‘World’s first’: IBM packs 100 billion transistors into a fingernail-sized sub-1 nm chip
SMRTR summary
IBM unveiled the world's first sub-1 nanometer chip, cramming nearly 100 billion transistors into a fingernail-sized device using a new 3D "nanostack" architecture. This design could deliver 50% better performance or 70% greater energy efficiency than current chips, with commercial products potentially arriving by 2031.
SMRTR provides this summary for quick context. The original article belongs to Interesting Engineering.
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